Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat.
Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
Features of cylindrical grinding wheel for silicon ingot
- Realizes a total-like cost cut by fast material removal
- Minimal influence on crystalline structure
- Low grinding load, good grinding performance and wear resistance
- Rngot surface with a high flat degree.
- Low dressing frequency