|
Electroformed dicing blade |
Features:
Easy to handle;
Variety of different grit concentrations;
Stable processing performance |
Hub dicing blade
|
|
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
||
|
Resin bond dicing blade |
Features:
High processing quality for cutting of hard, brittle materials;
Improved cut quality on hard materials |
Hubless dicing
blade |
|
Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
||
|
Metal bond dicing balde |
Features:
High rigidity minimized wavy&slant cutting;
Excellent rigidity and cut quality |
|
|
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
||
|
Electroformed dicing balde |
Features:
Wide selection of blade options
Proprietary thin-blade technology
Blade thickness - 0.015 mm to 0.3 mm
Available for both dicing saws and slicers |
|
|
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
||
|
Other specification can be produced according to customer’s requirements |
||