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Resin Bond Diamond Dicing Blades

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製品詳細

Description:
Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed.
Application:
Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.
Advantages:
1. High precision dicing
2. Improved cut quality on hard materials
3. Superior cut quality
4. Good wear resistance

Specifications:

Inner Diameter

Outer Diameter

Thickness

inches

mm

inches

mm

mm

1’’

25.4

2’’

50.8

0.07-2.00

1.5’’

38.1

2.25’’

57.1

1.575’’

40

2’’-3’’

50.8-76.2

2.75’’

 

69.8

4.4’’

101.6

4.5’’

114.3

3’’

76.2

4.4’’

101.6

4.5’’

114.3

5’’

127

3.497’’

88.82

4.256’’

108.1

4.6’’

116.8

4.7’’

119.4

5’’

127

3.5’’

88.9

4.256’’

108.1

4.6’’

116.8

 

関連製品

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info@moresuperhard.com +86-371-8654-5906 +86-18339903057 Zhongyuan Rd, Zhongyuan District, Zhengzhou, China

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