Pad properties:
Dimension: Diameter 200--1510 mm
Diamond grit: 120μm, 80μm, 45μm, 30μm, 20μm, 12μm, 9μm, 4μm, 2μm
Abrasive layer thickness: 0.9 mm
Bond type: Resin bond, Square structure
Carrier material: Polycarbonate
Backing: Self-adhesive, Metal foil only for diameter 200--400 mm
Grinding Parameter:
Dressing: Green Silicon Carbide grinding stone, 280# for the coarse abrasive(120μm, 80μm), 400# for the fine abrasive
Grinding:
Press: recommend 1.5 psi on the glass surface
Coolant: Flow--- 200 ml/min, when the plated surface temperature is higher, please increase the amount of flow
Pre grinding, the cutting force will be very high, so the shorter grinding time is better.