Back Grinding Wheels for Silicon Wafer Thinning

Description:

These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide. 

Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Applicable Grinding Machine:

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine

Advantages:

1.surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2.processing accuracy: TTV <5 um etc. (Total thinning veracity)

3.Processing quality:surface roughness: < 10 nm; damage layer thickness: < 10 um