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Back diamond grinding wheel
Back grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.
Application of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).
* Back diamond wheel for wafer grinding in microchip industry
* Back grinding wheel for LED substrate
Specifications of back grinding wheel
|
Model |
D (mm) |
T (mm) |
H (mm) |
|
6A2/6A2H |
175 |
30, 35 |
76 |
|
200 |
35 |
76 |
|
|
350 |
45 |
127 |
|
|
6A2T |
195 |
22.5, 25 |
170 |
|
280 |
30 |
228.6 |
|
|
6A2T(three ellipses) |
350 |
35 |
235 |
|
209 |
22.5 |
158 |
|
|
Other specifications can be produced according to customers' requirement. |
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The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry
| Application | Grinding wafer silicon in the microchip industry |
| Bonded | Vitrified bond Diamond Wheel |
| Wheel Type | 12A2T /C |
| Size |
180*40*104*5*10, grit size 400# 180*40*104*5*10, grit size 1500# 180*40*104*5*10, grit size 4000# |