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Back Grinding Wheel for Surface Grinding Various Silicon Wafer

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Product Details

Back diamond grinding wheel 

Back grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.

 

back grinding wheel diamond\

Application of back grinding wheel

Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

* Back diamond wheel for wafer grinding in microchip industry

back grinding wheels

back grinding wheels

 

* Back grinding wheel for LED substrate 

back diamond grinding wheel

Specifications of back grinding wheel

Model

D (mm)

T (mm)

H (mm)

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

6A2T

195

22.5, 25

170

280

30

228.6


6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers' requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry

back grinding wheels

Application Grinding wafer silicon in the microchip industry
Bonded Vitrified bond Diamond Wheel
Wheel Type 12A2T /C
Size 180*40*104*5*10, grit size  400#
180*40*104*5*10, grit size 1500#
180*40*104*5*10,  grit size 4000#

 

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