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Silicon grinding wheels/Silicon Wafer Back Grinding Wheels

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Product Details

Description of back grinding wheel:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.
wafer back grinding
Application of back grinding wheel:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
back grinding wheel diamond back grinding wheel
Advantages of diamond back grinding wheel:
1.High efficiency
2.High precision
3.Easy processing

Drawing&Specification:

Model

D (mm)

T (mm)

H (mm)

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

6A2T

195

22.5, 25

170

280

30

228.6


6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers’ requirement.

 

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