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Back Grinding Wheels for Various Silicon Wafer

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Product Details

Manufacturing Processes for Silicon Wafers

Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......

 

Applications of diamond back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

 

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

 

 

Model

D (mm)

T (mm)

H (mm)

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

6A2T

195

22.5, 25

170

280

30

228.6

6A2T(three ellipses)

350

35

235

209

22.5

158

Other specificationscan be produced according to customers requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry

Application Grinding wafer silicon in the microchip industry
Bonded Vitrified bond Diamond Wheel
Wheel Type 12A2T /C
Size 180*40*104*5*10, grit size  400#
180*40*104*5*10, grit size 1500#
180*40*104*5*10,  grit size 4000#

 

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