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Electroformed Diamond Dicing Blade - Hub Type

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Product Details

diamond dicing blade

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.

wafer diamond dicing blade hub type diamond dicing blade

Applications of electroformed diamond dicing blade

Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.

silicon wafer diamond dicing blade diamond dicing blade

hub type diamond dicing blade

Exposure(μm) 380 510 640 760 890 1020 1150 1270 Grit Size
Kerf width(μm) 380-510 510-640 640-760 760-890 890-1020 1020-1150 1150-1270 1270-1400 #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20 20*380 20*510            
21-25 25*380 25*510 25*640          
26-30 30*380 30*510 30*640 30*760 30*890 20*1020    
31-35 35*380 35*510 35*640 35*760 35*890 35*1020    
36-40 40*380 40*510 40*640 40*760 40*890 40*1020 40*1150  
41-50 50*380 50*510 50*640 50*760 50*890 50*1020 50*1150  
51-60   60*510 60*640 60*760 60*890 60*1020 60*1150 60*1270
61-70     70*640 70*760 70*890 70*1020 70*1150 70*1270
71-80         80*890 80*1020 80*1150 80*1270
81-90           90*1020 90*1150 90*1270
Special size can be designed according to customers' requirement

 

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info@moresuperhard.com +86-371-8654-5906 +86-18339903057 Zhongyuan Rd, Zhongyuan District, Zhengzhou, China

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