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Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.
Applications of electroformed diamond dicing blade
Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
| Exposure(μm) | 380 | 510 | 640 | 760 | 890 | 1020 | 1150 | 1270 | Grit Size |
| Kerf width(μm) | 380-510 | 510-640 | 640-760 | 760-890 | 890-1020 | 1020-1150 | 1150-1270 | 1270-1400 | #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500 |
| 16-20 | 20*380 | 20*510 | |||||||
| 21-25 | 25*380 | 25*510 | 25*640 | ||||||
| 26-30 | 30*380 | 30*510 | 30*640 | 30*760 | 30*890 | 20*1020 | |||
| 31-35 | 35*380 | 35*510 | 35*640 | 35*760 | 35*890 | 35*1020 | |||
| 36-40 | 40*380 | 40*510 | 40*640 | 40*760 | 40*890 | 40*1020 | 40*1150 | ||
| 41-50 | 50*380 | 50*510 | 50*640 | 50*760 | 50*890 | 50*1020 | 50*1150 | ||
| 51-60 | 60*510 | 60*640 | 60*760 | 60*890 | 60*1020 | 60*1150 | 60*1270 | ||
| 61-70 | 70*640 | 70*760 | 70*890 | 70*1020 | 70*1150 | 70*1270 | |||
| 71-80 | 80*890 | 80*1020 | 80*1150 | 80*1270 | |||||
| 81-90 | 90*1020 | 90*1150 | 90*1270 | ||||||
| Special size can be designed according to customers' requirement | |||||||||