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1A8 Ultra-thin diamond dicing blade( hub type and hubless type)
Blade thickness: 0.015 mm to 0.3 mm
Binder includes: resin bond diamond dicing blade (soft bond), metal bond diamond dicing blade (medium bond) and electroformed nickel dicing blade (hard bond)
Applications of diamond dicing blade
Scribing / cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row, to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge
Specifications of diamond dicing blade
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Electroformed dicing blade |
Easy to handle
Variety of different grit concentrations
Stable processing performance |
Hub dicing blade
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Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
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Resin bond dicing blade
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High processing quality for cutting of hard, brittle materials
Improved cut quality on hard materials |
Hubless dicing
blade |
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Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
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Metal bond dicing balde |
High rigidity minimized wavy&slant cutting
Excellent rigidity and cut quality |
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Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
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Electroformed dicing balde |
Wide selection of blade options
Proprietary thin-blade technology
Blade thickness - 0.015 mm to 0.3 mm
Available for both dicing saws and slicers |
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Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
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Other specification can be produced according to customer’s requirements |
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