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Resin Bond Diamond Dicing Blades

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Product Details

diamond dicing blade
Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed
diamond dicing blade
Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.
diamond dicing blade resin diamond dicing blade

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

 

Specifications of diamond dicing blade

Grit Type

OD (mm)

ID(mm)

T(mm)

Grit Size

1A8 SD / CBN

50.8

25.4

0.07 - 0.3

#200 - #3000

57.1

38.1

50.8-76.2

40

101.6 ,114.3

69.8

101.6, 114.3, 127

76.2

108.1, 127

88.82

108.1, 127

88.9

Special size can be designed depending on customers' requirement

 

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