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Metal bond Diamond Dicing Blades

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Product Details

diamond dicing blade for wafer

Metal bond blades are using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time, high rigidity minimized wavy and slant cutting, able to control diamond concentration to achieve cutting quality, excellent rigidity and cut quality.

metal bond diamond dicing blade diamond dicing blde for wafer

Applications of metal diamond dicing blade

Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, quartz, crystal, etc

silicon wafer dicing diamond dicing blade for silicon wafer

Specifications of diamond dicing blade

Grit Type

OD (mm)

ID(mm)

T(mm)

Grit Size

1A8 SD / CBN

50.8 - 125

40/ 55/ 75/ 88.9

0.075 - 0.35

#200 - #3000

Special size can be designed depending on customers’ requirement

 

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