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Metal bond blades are using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time, high rigidity minimized wavy and slant cutting, able to control diamond concentration to achieve cutting quality, excellent rigidity and cut quality.
Applications of metal diamond dicing blade
Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, quartz, crystal, etc
Specifications of diamond dicing blade
Grit Type |
OD (mm) |
ID(mm) |
T(mm) |
Grit Size |
1A8 SD / CBN |
50.8 - 125 |
40/ 55/ 75/ 88.9 |
0.075 - 0.35 |
#200 - #3000 |
Special size can be designed depending on customers’ requirement |